Core I9 Processor I9-13900 2.0 GHz 36MB Smart Cache

Introduction

Intel® Gaussian & Neural Accelerator
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speed-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.

Intel® Deep Learning Boost (Intel® DL Boost)
A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

Intel® Speed Shift Technology
Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.

Intel® Thermal Velocity Boost
Intel® Thermal Velocity Boost (Intel® TVB) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.

Intel® Turbo Boost Max Technology 3.0
Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.

Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Processor

Processor manufacturer

Intel

Processor generation

13th gen Intel® Core™ i9

Processor model

i9-13900

Processor family

Intel® Core™ i9

Processor cores

24

Processor socket

LGA 1700

Processor threads

32

Processor operating modes

64-bit

Performance cores

8

Efficient cores

16

Processor boost frequency

5.6 GHz

Performance-core boost frequency

5.2 GHz

Performance-core base frequency

2 GHz

Efficient-core boost frequency

4.2 GHz

Efficient-core base frequency

1.5 GHz

Processor cache

36 MB

Processor cache type

Smart Cache

Box

Y

Processor base power

65 W

Maximum turbo power

219 W

Maximum number of DMI lanes

8

Processor codename

Raptor Lake

Processor ARK ID

230499

Memory

Maximum internal memory supported by processor

128 GB

Memory types supported by processor

DDR4-SDRAM, DDR5-SDRAM

Memory channels

Dual-channel

ECC

Y

Memory bandwidth (max)

89.6 GB/s

Graphics

On-board graphics card

Y

Discrete graphics card

N

On-board graphics card model

Intel UHD Graphics 770

On-board graphics card outputs supported

Embedded DisplayPort (eDP) 1.4b, DisplayPort 1.4a, HDMI 2.1

On-board graphics card base frequency

300 MHz

On-board graphics card dynamic frequency (max)

1650 MHz

Number of displays supported (on-board graphics)

4

On-board graphics card DirectX version

12.0

On-board graphics card OpenGL version

4.5

On-board graphics card maximum resolution (DisplayPort)

7680 x 4320 pixels

On-board graphics card maximum resolution (eDP - Integrated Flat Panel)

5120 x 3200 pixels

On-board graphics card maximum resolution (HDMI)

4096 x 2160 pixels

On-board graphics card refresh rate at maximum resolution (DisplayPort)

60 Hz

On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel)

120 Hz

On-board graphics card refresh rate at maximum resolution (HDMI)

60 Hz

On-board graphics card ID

0xA780

Discrete graphics card model

Not available

Number of execution units

32

Multi-Format Codec Engines

2

Features

Execute Disable Bit

Y

Idle States

Y

Thermal Monitoring Technologies

Y

Market segment

Desktop

Use conditions

Workstation, PC/Client/Tablet

Maximum number of PCI Express lanes

20

PCI Express slots version

4.0, 5.0

PCI Express configurations

1x16+1x4, 2x8+1x4

Supported instruction sets

AVX 2.0, SSE4.1, SSE4.2

Scalability

1S

CPU configuration (max)

1

Embedded options available

Y

Direct Media Interface (DMI) Revision

4.0

Export Control Classification Number (ECCN)

5A992C

Commodity Classification Automated Tracking System (CCATS)

740.17B1

Processor special features

Intel® Hyper Threading Technology (Intel® HT Technology)

Y

Intel® Turbo Boost Technology

2.0

Intel® Quick Sync Video Technology

Y

Intel® Clear Video HD Technology (Intel® CVT HD)

Y

Intel® AES New Instructions (Intel® AES-NI)

Y

Enhanced Intel SpeedStep Technology

Y

Intel Trusted Execution Technology

Y

Intel® Speed Shift Technology

Y

Intel® Thermal Velocity Boost

Y

Intel® Turbo Boost Max Technology 3.0 frequency

5.5 GHz

Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0

Y

Intel® Thermal Velocity Boost Frequency

5.6 GHz

Intel® Control-flow Enforcement Technology (CET)

Y

Intel® Thread Director

Y

Intel VT-x with Extended Page Tables (EPT)

Y

Intel® Secure Key

Y

Intel® OS Guard

Y

Intel 64

Y

Intel Virtualization Technology (VT-x)

Y

Intel Virtualization Technology for Directed I/O (VT-d)

Y

Intel Turbo Boost Max Technology 3.0

Y

Intel® Boot Guard

Y

Intel® Deep Learning Boost (Intel® DL Boost)

Y

Intel® Volume Management Device (VMD)

Y

Mode-based Execute Control (MBE)

Y

Intel® Standard Manageability (ISM)

Y

Operational conditions

Tjunction

100 °C

Technical details

OpenCL version

3.0

Launch date

Q1'23

Logistics data

Harmonized System (HS) code

8542310001

Weight & dimensions

Processor package size

45 x 37.5 mm

Other features

L2 cache

32768 KB

Graphics output

eDP 1.4b, DP 1.4a, HDMI 2.1